During the semiconductor manufacturing process, minute contaminants on the surface and inside the chambers of equipment (such as particles, metal ions, organic substances, photoresist residues, etc.) may lead to:

Decrease in chip yield: Contaminants adhere to the surface of the wafer, causing short circuits, open circuits, or device failures.

Disruption of process stability: The accumulation of contaminants can affect the accuracy of the equipment (for example, contamination of the lithography machine lens leads to distortion of the lithography pattern).

Shortening of equipment lifespan: Corrosive contaminants may erode the chamber materials, affecting the equipment's sealing and vacuum performance.

Therefore, semiconductor equipment cleaning is a crucial step in ensuring process reliability and increasing production capacity, and it is involved in core processes such as lithography, etching, deposition, and ion implantation.