In the chip manufacturing process, the cleaning process before packaging is of great importance. During the previous manufacturing process of the chip, impurities such as photoresist, metal ions, particulate contaminants, and organic substances will remain on the surface. If these contaminants are not removed in a timely manner, they will cause poor bonding between the chip and the packaging material, leading to problems such as electrical short - circuits and abnormal signal transmission, and greatly reducing the reliability and service life of the chip.

Photoresist is an important material in the chip lithography process. After the pattern transfer is completed, the residual photoresist must be completely removed to avoid affecting the connection between the chip and the package. Metal ions such as sodium ions and copper ions will interfere with the electrical properties of the chip, causing leakage and even chip failure. Even tiny dust particles, as particulate contaminants, may become obstacles during the packaging process, resulting in packaging defects. For these contaminants, spray cleaning equipment, ultrasonic cleaning equipment, etc. can all play an important role. Take the spray cleaning equipment as an example. By spraying high - pressure chemical cleaning solutions and high - purity water, it can effectively dissolve photoresist, rinse away metal ions and particulate impurities, provide a clean surface for chip packaging, ensure the smooth progress of the packaging process, and thus improve the quality and performance of the finished chip.