During the semiconductor manufacturing process, minute contaminants on the surface and inside the chambers of equipment (such as particles, metal ions, organic substances, photoresist residues, etc.) may lead to:Decrease in chip yield: Contaminants adhere to the surface of the wafer, causing short circuits, open circuits, or device failures.Disruption of process stability: The accumulation of contaminants can affect the accuracy of the equipment (for example, contamination of the lithography machine lens leads to distortion of the lithography pattern).Shortening of equipment lifespan: Corrosive contaminants may erode the chamber materials, affecting the equipment's sealing and vacuum performance.Therefore, semiconductor equipment cleaning is a crucial step in ensuring process reliability and increasing production capacity, and it is involved in core processes such as lithography, etching, deposition, and ion implantation.

In the chip manufacturing process, the cleaning process before packaging is of great importance. During the previous manufacturing process of the chip, impurities such as photoresist, metal ions, particulate contaminants, and organic substances will remain on the surface. If these contaminants are not removed in a timely manner, they will cause poor bonding between the chip and the packaging material, leading to problems such as electrical short - circuits and abnormal signal transmission, and greatly reducing the reliability and service life of the chip.Photoresist is an important material in the chip lithography process. After the pattern transfer is completed, the residual photoresist must be completely removed to avoid affecting the connection between the chip and the package. Metal ions such as sodium ions and copper ions will interfere with the electrical properties of the chip, causing leakage and even chip failure. Even tiny dust particles, as particulate contaminants, may become obstacles during the packaging process, resulting in packaging defects. For these contaminants, spray cleaning equipment, ultrasonic cleaning equipment, etc. can all play an important role. Take the spray cleaning equipment as an example. By spraying high - pressure chemical cleaning solutions and high - purity water, it can effectively dissolve photoresist, rinse away metal ions and particulate impurities, provide a clean surface for chip packaging, ensure the smooth progress of the packaging process, and thus improve the quality and performance of the finished chip.

In the field of semiconductor manufacturing, wafer cleaning is a crucial process to ensure the quality and performance of chips. If there are particulate impurities, metal impurities, organic impurities, etc. on the surface of the silicon wafer, problems such as current leakage and low breakdown voltage will occur, seriously reducing the chip yield.As a commonly used wafer cleaning tool, the spray cleaning equipment plays an important role. Its working principle is to generate high-pressure water or chemical solutions through a high-pressure pump, and form high-pressure water columns or fine water mists through specially designed nozzles to strongly impact and wash the surface of the wafer. During the cleaning process, the high-speed water flow can effectively peel off various pollutants on the surface of the wafer and remove them from the wafer surface.Compared with other cleaning methods, the spray cleaning equipment has significant advantages. In terms of operation, it is relatively simple, making it easy for workers to get started and for daily maintenance. It has a high cleaning efficiency and can quickly complete the cleaning of wafers to meet the needs of large-scale production. In general cleaning processes, it can perform tasks excellently, effectively remove common dirt on the surface of wafers, ensure the cleanliness of wafers, lay a good foundation for subsequent chip manufacturing processes, and help improve the overall quality and efficiency of chip manufacturing.