As the core equipment of the modern electronics industry, the third-generation intelligent ultrasonic cleaning equipment generates a micron-level cavitation effect through high-frequency mechanical waves (20kHz - 130kHz). Under nano-level cleanliness control, it can deeply remove various contaminants remaining on the surface of PCB substrates, including micron-sized solder balls (≤50μm), organic acid/lead-free flux residues, metal oxide passivation layers (such as CuO, SnO2, etc.), and sub-micron dust particles (≥0.1μm). The equipment uses a multi-frequency adjustable transducer array, combined with an intelligent temperature control system (25 - 65℃±1℃) and a neutral and environmentally friendly cleaning agent, to achieve non-destructive cleaning of precision components such as BGA packages and QFP chips. Verified by the IPC-A-610G standard, the surface ionic contamination after cleaning is ≤1.56μg/cm², and the contact angle is <25°, effectively eliminating the risk of micro-shorts and ensuring the long-term reliability of high-density integrated circuits in extreme temperature cycles (-55℃~125℃) and an 85%RH humidity environment. The specially configured megahertz acoustic wave auxiliary module (950kHz) of the system can penetrate micro-hole structures less than 0.2mm, meeting the ultra-clean requirements of 3D packaging chips and MEMS devices and conforming to the MIL-STD-883J military standard.