(1) Ultrasonic Cleaning MachineWorking principle: Utilize the "cavitation effect" generated by ultrasonic waves in the cleaning solution to form the impact force when tiny bubbles burst, peeling off stubborn stains (such as polishing wax, sintered carbides) on the surface of parts.Advantages: Suitable for parts with complex structures (such as blind holes, deep grooves, multi - hole parts), the cleaning accuracy can reach 5 - 10μm, with a high degree of automation and can be integrated into the production line.Typical applications: Cleaning of precision components such as electronic components (such as PCB boards), watch parts, fuel injectors, etc.(2) Spray Cleaning MachineWorking principle: Spray the heated cleaning solution (such as alkaline solution, water - based cleaning agent) onto the surface of parts through high - pressure nozzles, and use mechanical impact force and chemical action to remove oil stains and chips.Advantages: High cleaning efficiency (single - batch processing time is 5 - 15 minutes), suitable for medium - to - large - sized parts (such as automotive engine blocks, box - type parts), and can be equipped with a rotating worktable to achieve all - round cleaning.Technical parameters: The spray pressure is usually 0.3 - 1MPa, the temperature control range is 40 - 80℃, and a filtration system (with an accuracy of 50 - 100μm) is required to prevent nozzle blockage.(3) Drum Cleaning MachineWorking principle: Parts and cleaning media (such as steel balls, plastic particles) rub against each other in a rotating drum, and combined with a cleaning agent to remove surface burrs and oxide scale, having both deburring and cleaning functions.Advantages: Suitable for small - to - medium - sized parts produced in batches (such as standard parts, die - cast parts), which can reduce the cost of manual deburring, but may cause scratches on the surface of precision parts.(4) Vapor - phase Cleaning MachineWorking principle: Utilize the vapor - condensation characteristics of solvents such as halogenated hydrocarbons, and dissolve the grease on the surface of parts through steam condensate. It is suitable for high - precision and easily corroded parts (such as optical lenses, semiconductor devices).Advantages: No liquid residue, and parts can be directly assembled after cleaning. However, attention should be paid to the environmental friendliness of the solvent (such as replacing ODS substances with hydrocarbon solvents).

1. Pretreatment before processingRemove blank impurities: Sand, scale, release agents, etc. on the surface of casting and forging blanks need to be removed before machining to avoid contaminating the cutting fluid and accelerating tool wear.Eliminate storage pollutants: Rust-proof oil, dust, etc. on the surface of inventory parts affect the positioning accuracy. Cleaning is required to ensure a tight fit between the fixture and the part.2. Cleaning between processesTreatment of cutting fluid residue: After processes such as turning and milling, if the emulsions and cutting oils remaining on the part surface are not removed, it may lead to a decline in machining accuracy in subsequent processes (such as grinding and electrical discharge machining) or cause corrosion.Removal of chips and burrs: After precision machining (such as gear machining and thread machining), fine chips or burrs may embed in the part surface, affecting the machining quality of the next process (such as foreign object wear during bearing installation).3. Final inspection after processing and cleaning before assemblyCleanliness requirements for precision parts: High-precision parts in fields such as aerospace and medical devices (such as hydraulic valves and bearings) need to meet micron-level cleanliness standards through cleaning to avoid functional failures caused by impurities.Pretreatment for surface treatment: Before electroplating, spraying, and anodizing, the grease and pollutants on the part surface must be thoroughly removed; otherwise, it will result in insufficient coating adhesion or pitting.

The high-pressure spray cleaning machine, through the collaborative action of the ultra-high-pressure plunger pump unit (working pressure 35 - 50MPa) and the multi-directional rotating spray mechanism, can efficiently remove the cutting fluid, rust-proof oil, and metal debris remaining on precision metal components such as engine blocks and transmission casings during the machining process. This equipment integrates a three-stage filtration device (including a magnetic separator, a vortex sedimentation tank, and a precision bag filter) into the circulating water treatment system, achieving a water resource reuse rate of over 85%. Coupled with a constant temperature heating module (adjustable from 40 - 60C) and an environmentally friendly cleaning agent, while ensuring the cleaning cleanliness (surface residue 0.1mg/cm²), the water consumption per workpiece is reduced by 62% compared to traditional cleaning processes, and the comprehensive operating cost is saved by over 35%, meeting the energy conservation and emission reduction requirements of the modern green manufacturing system.

As the core equipment of the modern electronics industry, the third-generation intelligent ultrasonic cleaning equipment generates a micron-level cavitation effect through high-frequency mechanical waves (20kHz - 130kHz). Under nano-level cleanliness control, it can deeply remove various contaminants remaining on the surface of PCB substrates, including micron-sized solder balls (50μm), organic acid/lead-free flux residues, metal oxide passivation layers (such as CuO, SnO2, etc.), and sub-micron dust particles (0.1μm). The equipment uses a multi-frequency adjustable transducer array, combined with an intelligent temperature control system (25 - 65℃1℃) and a neutral and environmentally friendly cleaning agent, to achieve non-destructive cleaning of precision components such as BGA packages and QFP chips. Verified by the IPC-A-610G standard, the surface ionic contamination after cleaning is 1.56μg/cm², and the contact angle is <25, effectively eliminating the risk of micro-shorts and ensuring the long-term reliability of high-density integrated circuits in extreme temperature cycles (-55℃~125℃) and an 85%RH humidity environment. The specially configured megahertz acoustic wave auxiliary module (950kHz) of the system can penetrate micro-hole structures less than 0.2mm, meeting the ultra-clean requirements of 3D packaging chips and MEMS devices and conforming to the MIL-STD-883J military standard.