Working Principle

Take the semiconductor workpiece as the anode and place it in the corresponding electrolyte (such as sulfuric acid, chromic acid, oxalic acid, etc.). Electrolysis is carried out under specific conditions and the action of an applied current. The semiconductor material at the anode undergoes an oxidation reaction, and an oxide film with functions such as protection and insulation is formed on the surface.

Composition of the Production Line

Pre-treatment Unit: It includes processes such as degreasing, alkaline cleaning, and pickling. The purpose is to remove oil stains, impurities, and the natural oxide layer on the surface of the semiconductor workpiece, providing a clean and active surface for subsequent anodizing.

Anodizing Unit: This is the core part. By precisely controlling parameters such as the composition of the electrolyte, temperature, current density, and oxidation time, a uniform, dense oxide film with a thickness meeting the requirements is formed on the surface of the semiconductor.

Post-treatment Unit: It usually includes processes such as dyeing and sealing. Dyeing can make the oxide film show different colors to meet aesthetic or specific functional requirements. Sealing is to close the micropores on the surface of the oxide film, improving the corrosion resistance, wear resistance, and insulation of the oxide film.

Auxiliary Systems: It includes a power supply system, a cooling system, a circulation and stirring system, an exhaust gas treatment system, and a wastewater treatment system, etc. The power supply system provides stable current and voltage. The cooling system controls the temperature of the electrolyte. The circulation and stirring system ensures the uniform composition of the electrolyte. The exhaust gas treatment system treats the harmful gases generated during the production process. The wastewater treatment system treats the wastewater and discharges it after meeting the standards.

Equipment Features

High-precision Control: High precision is required for controlling parameters such as temperature, current density, and oxidation time to ensure the quality and performance consistency of the oxide film. High cleanliness requirements: The production environment needs to be kept highly clean to avoid the surface of the semiconductor workpiece being contaminated by particulate impurities, which may affect the quality of the oxide film.

High Degree of Automation: Advanced automated control systems such as programmable logic controllers (PLCs) and touchscreen controls are often used to achieve automated operation, monitoring, and fault diagnosis of the production process, improving production efficiency and the stability of product quality.

Strong Material Corrosion Resistance: Due to contact with corrosive electrolytes, components such as the tanks and brackets of the production line mostly use high-quality stainless steel, imported PP boards, and other acid and alkali resistant, high-temperature resistant materials to extend the service life of the equipment.